| 发明名称 |
MICROELECTRONIC ASSEMBLY WITH BUILT-IN THERMOELECTRIC COOLER AND METHOD OF FABRICATING SAME |
| 摘要 |
<p>A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.</p> |
| 申请公布号 |
EP1834354(A1) |
申请公布日期 |
2007.09.19 |
| 申请号 |
EP20050856066 |
申请日期 |
2005.12.27 |
| 申请人 |
INTEL CORPORATION |
发明人 |
FARAHANI, MOHAMMAD;CHRYSLER, GREGORY;FRUTSCHY, KRIS |
| 分类号 |
H01L23/38;H01L35/28 |
主分类号 |
H01L23/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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