发明名称 Cooling assembly for an integrated circuit
摘要 The assembly includes an engaging plate (24) mounted on a fin (21) of each of the two outermost opposite rows of fins of a finned plate (2). Each engaging plate includes at least one first slot (241) for releasably engaging with an associated protrusion (12) on a pin seat (11) and a second slot (242). A cam plate (25) is mounted adjacent each engaging plate and includes an eccentric hole (251). A screw (23) is extended through the eccentric hole of each cam plate, the second slot of the associated engaging plate, and a hole (22) of the associated fin. When the cam plate is rotated about the screw to bear against a lip (243) formed at the top of the associated engaging plate, the engaging plate is moved upwardly such that the first slot of the engaging plate firmly engages with the associated protrusion.
申请公布号 GB2317051(A) 申请公布日期 1998.03.11
申请号 GB19960018770 申请日期 1996.09.09
申请人 CHING-SHEN * HORNG 发明人 CHING-SHEN * HORNG
分类号 H01L23/40;(IPC1-7):H01L23/40 主分类号 H01L23/40
代理机构 代理人
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