Electrical component suction surface formation method e.g. for SMD components on PCB

摘要

The method provides a planar suction surface (6) on the opposite side of the component (1) to that mounted on a printed circuit board, by application of an adhesive mass (21) and subsequent application of a cover band (13). The cover band is subsequently removed after hardening of he adhesion mass, with the revealed surface forming the planar suction surface.