发明名称 Device for separating wires, etc. from wire bundle, etc.
摘要 The device (1) incorporates a feed plane (3) inclined in the feed direction (5) to receive a wire bundle (13) and a centrally arranged guide component (6) with a control gap (16). The control gap width corresponds to the wire diameter and accommodates the separated wires in a single layer (14). Before the bundle is received in the control gap, it is processed by several processing components (8.1,8.2,9.1,9.2,10.1,10.2), which are arranged on both sides of the guide component and have a spreading edge parallel to the feed plane and a discharge edge directed against the wire bundle. A drive mechanism is so formed that the processing components execute a stretch movement. In a first cycle section of the spreading movement, the spreading edge, commencing from a starting point (A1), is guided over the single wire layer. In a second cycle section, the stretch edge is raised from the wire layer.
申请公布号 DE19647441(A1) 申请公布日期 1998.03.12
申请号 DE19961047441 申请日期 1996.11.16
申请人 H.A. SCHLATTER AG, SCHLIEREN, ZUERICH, CH 发明人 RAPPOLD, DIETMAR, DIETIKON, CH;MEIER, ROBERT, WETTSWIL, CH
分类号 B21F23/00;B65H51/005;(IPC1-7):B65H51/005;B65G47/08 主分类号 B21F23/00
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