| 摘要 |
PROBLEM TO BE SOLVED: To make a large sized semiconductor wafer sucking fork needless, by a method wherein the semiconductor sucking fork is positioned so as to oppose to the surface in the oblique direction of large sized wafers, so that the semiconductor wafers may be pressurized to bring the semiconductor wafers upright. SOLUTION: A plurality of large sized semiconductor wafers 1 are arrayed in a containing carrier 3 in the longitudinal direction to be contained in an oblique state. A semiconductor wafer sucking fork 8 is positioned with its sucking part 10 turning forward above the space between the semiconductor wafers 1 and the other semiconductor wafers 1 positioned on the rear side of the former ones 1. Next, the semiconductor sucking fork 8 is shifted downward to be positioned on the part opposing to the upper end part rear surface. Furthermore, the fork 8 is shifted forward to pressurize the semiconductor wafers 1 for bringing upright and sucking. Through these procedures, the semiconductor wafer sucking fork 8 is shifted upward so as to lift up the semiconductor wafers 1 to be taken out. |
