发明名称 VERTICAL FURNACE FOR SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To provide a vertical furnace for a semiconductor wafer which can automatically transfer a semiconductor wafer and is capable of film formation, diffusion, etc. only for a single surface. SOLUTION: This vertical furnace for a semiconductor wafer consists of a furnace body having a vertical furnace core tube, a boat 1 inserted in the furnace tube, a plate main body 7 which is horizontally fixed to the inside of the boat and has a notched part 6 opened on the periphery, and a detaching part 8 which is installed on the notched part from above and can retain a wafer W together with the plate main body. A wafer mounting plate 5 for mounting a wafer, and a robot main body 1 which can rotate around a vertical shaft as a center and moves vertically and horizontally are installed. The boat consists of two thin arms 12 which reciprocate in the horizontal direction and retain a wafer, and a rectangular frame type arm 13 which is positioned between the arms, can move vertically and horizontally, and retains the detaching part. A wafer transferring robot 10 which tranfers a wafer between the boat and a wafer cassette is installed.
申请公布号 JPH1070081(A) 申请公布日期 1998.03.10
申请号 JP19960245569 申请日期 1996.08.28
申请人 TOSHIBA CERAMICS CO LTD 发明人 TAKESAKO KENICHI
分类号 H01L21/677;H01L21/205;H01L21/22;H01L21/31;H01L21/68;(IPC1-7):H01L21/205 主分类号 H01L21/677
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