| 摘要 |
PROBLEM TO BE SOLVED: To realize a miniature shape and thin shape, to simplify a manufacturing process and to reduce cost. SOLUTION: A laser beam receiving and emitting package 3, biaxis device 5 transferring an objective lens 4 and connector 6 for external connection are respectively placed and fixed on a wiring substrate 1 formed wiring patterns 2a, 2b so as to electrically connect to wiring patterns 2a, 2b. A laser coupler 11 formed an optical prism 15 and laser chip 16 on a photo diode IC14 provided with optical signal detecting photo diodes 12, 13 is packaged in the laser beam receiving and emitting package 3. A sub-wiring substrate attached the laser coupler 11 may be inserted into the hole formed in the wiring substrate 1 and fixed instead of using the laser beam receiving and emitting package 3. |
