| 摘要 |
PROBLEM TO BE SOLVED: To easily form a bump and to change its height easily by a method wherein the bump, to be formed on the electrode of a semiconductor device, is constituted by a wire whose both ends are connected to the two parts of the electrode. SOLUTION: A pair of Al electrodes 20a and 20b are formed separately with each other on a semiconductor chip 1, and using a capillary 7, the first wire bonding operation is conducted on Al electrodes 20a by a gold wire 5, and the second wire bonding operation is conducted on the other electrode 20b. As a result, a cone-shaped bump 50 is formed by a bonding gold wire 5. At this point, when a wire bonding operation is conducted, the height of the bump 50 can be adjusted by changing the length of the gold wire 5. |
