| 摘要 |
PROBLEM TO BE SOLVED: To lower the resistance of the wiring layer of a wiring board by making metallic particles include coarse and fine particles of specific diameters in a specific ratio, which are in respective specific proportions to the total amount of the metallic particles. SOLUTION: This conductive composition comprises 98.8 to 99.9wt.% metallic particles and 0.1 to 1.2wt.%, binding organic resin, the metallic particles including 50 to 90wt.% course particles which are 6 to 10μm in diameter, 50 to 90wt.% fine particles 1 which are not more than 1μm in diameter, and 10 to 50wt.% fine particles 2 which are not more than 1μm in diameter, for the total amount of the metallic particles. When silver-coated copper particles are used as the metallic particles, a resin that can be decomposed at 20 deg.C is used as the organic resin for binding them. Particularly for lowering the resistance of the conductive composition, Ag, Cu, Au, etc., are suitably used. Among them, the silver-coated copper particles are best suited from the standpoint of migration resistance as well as lower resistance and cost.
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