| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor element housing package and the mounting structure thereof which can maintain rigid and stable connection for a long period of time the package for housing, for an external electric circuit using glass-epoxy resin as an insulator, a wiring board providing a metal wiring layer at the surface or inside of the insulating board having a high thermal expansion characteristic and a semiconductor element having a high thermal expansion characteristic and housing semiconductor element. SOLUTION: In a wiring board providing a metal wiring layer 3 of Ag at the surface or inside of an insulating board 1 or a package A for housing semiconductor element, the insulting board 1 is formed by a sintered body having the thermal expansion coefficient at 40 to 400 deg.C of 8 to 18ppm/ deg.C obtained by sintering a mold body including the glass powder of 20 to 80 volume % including BaO of 10wt.% or more and the filler of 80 to 20 volume % including metal oxide of the thermal expansion coefficient of 6ppm at 40 to 400 deg.C. This insulating board 1 is then mounted, via the connecting terminal 4, by the soldering junction on the external electric circuit board B where the wiring conductor 8 is deposited on the surface of insulator including at least an organic resin. |
