SLURRY FOR CHEMICAL AND PHYSICAL GRINDING CONTAINING FLUORIDE ADDITIVE AND ITS USE

摘要

PROBLEM TO BE SOLVED: To provide a slurry for chemical and mechanical polishing which can polish titanium at far much higher speed than the conventional technique without damage or defect to the product, sustains high polishing speed comparable to that of tungsten and titanium nitride and shows slow polishing speed in silica. SOLUTION: This aqueous slurry for chemical and mechanical polishing contains an oxidizing agent, a polishing agent and a fluoridecontaining additive. In a preferable embodiment, the slurry contains about 0.01-2.0wt.% of the fluoride-containing additive, which is selected from a fluoride-containing acid and a fluoride salt. The fluoride-containing additive is preferably selected from hydrofluoric acid, fluorosilicic acid and fluorotitanic acid and the content of the fluoride-containing acid is about 0.01-0.3wt.% the fluoride salt is selected from ammonium fluoride, potassium fluoride, ammonium hydrogen difluoride and potassium hydrogen difluoride.