| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for stripping and removing an IC mounted on a board easily without causing damage to the board. SOLUTION: When an IC device is stripped from a board, a tool is positioned directly above the IC device (#1) and then the tool is lowered down to a predetermined position (#2). The tool is then applied to the IC device mounted on the board through an adhesive, solder or paste and the IC device is stripped from the board by turning the tool (#3). Since the IC device can be stripped with a relatively small force, cracking of the IC device and damage on the board can be minimized. |
