| 摘要 |
An integrated circuit includes a data terminal, a supply potential terminal, a configuration signal generator with an input, a buffer circuit with a terminal and a bond pad connected to the input and the terminal. The bond pad is connected to the data terminal for operating the integrated circuit using the buffer circuit and the bond pad is connected to the supply potential terminal for operating the integrated circuit using the configuration signal generator. A method for producing such an integrated circuit includes connecting the input of the configuration signal generator and the terminal of the buffer circuit to the bond pad. The bond pad is connected to the supply potential terminal for operating the finished integrated circuit using the configuration signal generator, or to the data terminal for operating the finished integrated circuit using the buffer circuit.
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