PARTIAL PLATING OF BOARD FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To easily select a specified position for the plating and control freely the amount of plating with higher accuracy. SOLUTION: After arranging and coupling miniature metal balls 4 to a copper wiring lead 2 of a glass epoxy board 1, such miniature metal balls 4 are fused. Thereby, the copper wiring lead 2 of the glass epoxy board 1 is selectively coated with a different kind of metal to easily executing the plating to the specified area of the board for electronic components with higher accuracy.