| 摘要 |
PROBLEM TO BE SOLVED: To provide a power amplification module having attained high performance by releasing heat generated by a power amplifier to the external side in a higher efficiency. SOLUTION: This module 10 is provided with a package 20 formed by coupling an almost flat base plate 30 and a cap 40 as an almost box type metal package cap. On the base plate 30, an almost flat type insulating substrate 50 and this substrate is covered with the cap 40. The insulating substrate 50 is provided with a couple of through holes 52a, 52b and almost flat type two heat spreaders 60a, 60b are provided on the base plate 30 exposed from these through holes 52a, 52b. On the surfaces of these heat spreaders 60a, 60b, the semiconductor devices 70a, 70b sealed by the resin, etc., are provided and soldered, respectively. |
