| 摘要 |
PROBLEM TO BE SOLVED: To provide a system module having a construction in which a second semiconductor device is mounted on a first semiconductor device, to which process technique most suitable to each semiconductor device from the viewpoint of costs, performance, and the like can be applied even when the first and the second semiconductor devices are formed in a process of the same generation. SOLUTION: A semiconductor device has a construction in which a second semiconductor device 1 is mounted on a first semiconductor device 5. In this case, the narrowest line width and the narrowest wiring interval of a wire 7 formed in the first semiconductor device 5 are different from those of a wire 2 formed in the second semiconductor device 1, or the number of wiring layers of the wire 7 formed in the first semiconductor device 5 is different from the number of wiring layers of the wire 2 formed in the second semiconductor device 1. |
