PACKAGED COMPONENT COOLING STRUCTURE,申请号JP19960225407-传众专利搜索

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发明名称	PACKAGED COMPONENT COOLING STRUCTURE
摘要
申请公布号	JPH1070222(A)	申请公布日期	1998.03.10
申请号	JP19960225407	申请日期	1996.08.27
申请人	FUJITSU LTD	发明人	FUJISAKI AKIHIKO
分类号	H05K7/20;H01L23/36;H01L23/40;(IPC1-7):H01L23/40	主分类号	H05K7/20
代理机构		代理人
主权项
地址

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