| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board excellent in adhesiveness between an interlayer insulating layer and a plated conductive layer with high heat resistance, environmental safety, and high reliability and improved in manufacturing efficiency. SOLUTION: This method provides a multilayer wiring board having a plurality of layers of wiring patterns 2 and an interlayer insulating layer 3 at least on one side surface of a substrate 1 and via holes 5 for mutually and electrically connecting the wiring patterns to the prescribed parts of this interlayer 3. At this time, to provide the via holes 5, films 4 with sand blast resistance are patterned on the interlayer insulating layer 3, which is selectively removed by sand blast treatment so as to form the via holes 5. Then, the films 4 with sand blast resistance is removed for a succeeding treatment of direct electrolytic plating so as to provide conductive layers 7. |
