| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability in the electrical contact with the electrode part of a bare chip drastically by preventing the thermal deformation of a bare chip carrier in a burn-in test positively. SOLUTION: A variable press means consisting of a screw 3b and an elastic body 4 is provided at the center of a pressurization lid 3 of a bare chip carrier 2, and a carrier base 7 is formed in a semicylindrical shape where it is swollen such that the thickness increases from the peripheral part toward the center. The elastic body 4 is deformed by the screw 3b and the contact between a bump 1a formed at a bare chip 1 and a tape electrode 5a is stabilized by the variable pressure. Also, the thickness at the swell of the carrier base is approximately 100-500μm. The carrier base 7 is deformed due to the heating of the burn-in test and the surface becomes flat, thus bringing the tape electrode 5a and the substrate electrode 6a into contact positively.
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