| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the shield for an electrostatic chuck by which deposition of a gas product is suppressed. SOLUTION: The shield 5 for an electrostatic chuck 4 of this invention includes a 1st shield member 60 surrounding the chuck and a 2nd shield member 62 supported on the 1st shield member. The 2nd shield member 62 has an upper face surrounding a wafer and receives deposition resulting from a gas in a processing chamber. Since the shield is divided into the two members, a temperature of the 2nd shield is increased during the treatment thereby decreasing the deposition rate onto an exposed face and increasing a rate of the exposed face with respect to a thermal mass of the 2nd shield member 62. In addition, since a cleaning rate of the shield or the deposited material elimination rate is a function of the temperature, the cleaning rate of the 2nd shield member is improved.</p> |
