发明名称 POWER SEMICONDUCTOR MODULE
摘要 PROBLEM TO BE SOLVED: To prevent adhered zones from peeling by providing an additional structure which allows the relative displacement of the side face to the bottom face, with keeping the condition that the gap between the adhered zones of the side face and bottom face does not exceed a fixed value. SOLUTION: Mounting holes 105 are bored through the four corners of an Mo base 101 to be the bottom of a module and it is fixed to a heat sink, utilizing the mounting holes 105. To adhere the Mo base 101 to a resin case 102 with adhesives, holes are bored into the centers of the four sides of the resin case 102 and corresponding holes are bored into the centers near the ends of the base 101, and screws 106 are inserted from the base 101 into nuts 107 in the resin case 102 to only limit the adhered parts from exceeding fixed gaps by the screws 106, thus preventing the adhered parts from peeling.
申请公布号 JPH1065097(A) 申请公布日期 1998.03.06
申请号 JP19960217078 申请日期 1996.08.19
申请人 HITACHI LTD 发明人 INOUE KOICHI;KOIKE YOSHIHIKO;TANAKA AKIRA;SAITO RYUICHI
分类号 H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L25/07
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