| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor package by preventing the disconnection failure of a lead due to environmental stress. SOLUTION: A semiconductor package includes a semiconductor chip 15 where a plurality of electrode pads 16 are formed at the peripheral edge of a chip surface, a wiring film 7 that is arranged and fixed at the surface side of the semiconductor chip 15 and at the same time where an insulation film 6 is laminated on a lead pattern 5, a plurality of leads 9 that are extended from the wiring film 7, at the same time where the extended edge is connected to the electrode pad 16 of the semiconductor chip 15 by a specific bending forming and its bending position L is arranged inside the lamination region of the insulation film 6, and a sealing resin 17 where the peripheral region of the semiconductor chip 15 including the boundary part between each lead 9 and the insulation film 6. |
