| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size, weight, and cost of the cooling structure of an uninterruptible power supply. SOLUTION: With a first basic configuration in (a), a semiconductor switch 1 is provided at one vertical part of a base plate 11 with a high thermal conductivity being formed in inverted U shape, a semiconductor element 2 belonging to a multifunctional inverter is provided at the other vertical part, and a fin unit 5 is provided at a horizontal part. Also, the capacity of the fin unit 5 is determined by the calorific value of the semiconductor element 2 that is larger than the calorific value of the semiconductor switch 1. Therefore, heat generated selectively by the semiconductor switch 1 and the semiconductor element 2, namely heat generated from the semiconductor switch 1 in a normal case and heat generated from the semiconductor element 2 when power fails or the semiconductor switch 1 fails are discharged via the fin unit 5. Each second and third basic configurations in (b) and (c) differ from the first one, where base plates 12 and 13 are in inverted L shape and the semiconductor switch 1 and the semiconductor switch 2 are horizontal to a vertical part or are provided side by side in upper and lower directions. |
