| 摘要 |
PROBLEM TO BE SOLVED: To make the pressure controllable at only one point by mounting a semiconductor chip in the bottom of a recess of a case and sealing the opening of the recess of the case with a cap adhered to the chip. SOLUTION: A case 3 has inner leads 7 electrically connected to outer terminals 8 for interconnecting signals with a semiconductor chip 1. A cap 4 seals a recess of the case 3 and serves as a heat sink adhered to the chip 1. Conductive ball bumps 2 are mounted on wiring leading terminals of the chip 1 and back side of the chip 1 is adhered to the cap 4 with a resin 5. The ball bumps 2 are positioned to the inner leads 7 in the recess of the case 3 and face-bonded to seal the recess of the case 3 with the cap 4, using a resin 6. For sealing with the cap 4 it suffices that the pressure is controlled only between the bumps 2 and inner leads 7 of the case 3. |
