| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which can prevent a junction part from breaking on a chip surface by stress, can simultaneously suppress the influence of radiation and is capable of high speed sealing. SOLUTION: A device is comprised of electrode pads 3 formed at a peripheral part of a chip surface, a semiconductor chip 2 provided at the pads forming region as an effective element region 4, an insulating thick film preventing layer 6 laminated on the effective element region 4 of the semiconductor chip 2, outer leads 10b prevented by an insulating film 11 and inner leads 10a integrally extended in an unit from the outer leads 10b. The device is further provided with the leads 10 on the outer leads 10b of which external junctioning electrodes 12 are formed and a terminal of the inner lead 10a of which is junctioned with the electrode pads 3, an enforced plate 7 which is provided under the condition of surrounding the semiconductor chip 2 and a sealing resin 15 which is filled in a peripheral region of a semiconductor chip 1. |
