SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To mount a semiconductor chip with its face up and reduce the mounting area by using a semiconductor chip having bump electrodes formed on input/output terminals arranged at the marginal area of the chip and electrically connecting the bump electrode side faces to the wiring electrode surface on a board with solder bridges. SOLUTION: Input/output terminals 9 are formed at the marginal area of a base semiconductor chip 2 and bump electrodes 4 formed on the terminals 9. A semiconductor chip 3 mounted on the chip 2 is mounted on a mounting board 1 with a hybrid IC molded with a resin mold 13 and bump electrodes 4 electrically connected to wiring electrodes 11 near the electrodes 4 through bridges 5. The side faces of the electrodes 4 are flush with the side face of the base board 2 and solder bumps formed at the side faces are well connected. Thus it is possible to place the wiring electrodes 11 near round the chip 2 on the board 1 and reduce the mounting area.