| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesion between an injection molding printed wiring body and solder resist ink, by irradiating an ultraviolet ray on an injection molding body, when forming a solder resist layer in an injection molding printed wiring body wherein a conductive circuit is formed in an injection molding object in which a thermoplastic resin is used. SOLUTION: When a solder resist layer is formed in an injection molding printed wiring body, an ultraviolet ray of 100 to 10000mJ is irradiated in advance to an untreated molded object. If an irradiating amount of the ultraviolet ray is smaller than 100mJ, satisfactory surface deformation effect of base resin is not obtained and if it is larger than 10000mJ, it is undesirable since a surface of the base resin changes to yellow and furthermore, characteristics thereof deteriorates. Thereby, a surface is modified by providing functional group such as hydroxyl group to a surface of thermoplastic resin which is a base resin of a molded object by oxidation function of ultraviolet rays and adhesion with solder resist ink can be improved. |
