发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR EXPOSURE WITH FAR ULTRAVIOLET RAY
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. having high transparency to light of short wavelength for exposure and satisfying photodegradability and high efficiency of acid generation by incorporating a specified N- hydroxymaleimide type sulfonate photo-acid generating agent and a resin having substituents increasing solubility to an alkali developer under an acid. SOLUTION: This photosensitive resin compsn. contains an N- hydroxymaleimide type sulfonate photo-acid generating agent represented by the formula and a resin having substituents increasing solubility to an alkali developer under an acid. In the formula, each of R1 and R2 is H, 1-6C alkyl or <=6C cycloalkyl, R1 and R2 may form a ring by bonding through an alkylene chain and R3 is alkyl, perfluoroalkyl, cycloalkyl or a substitution product of camphor. Since this compsn. has high transparency to light of 170-220nm wavelength and has high efficiency of acid generation at the time of exposure with light of 170-220nm wavelength, it is fit for exposure with light of 170-220nm wavelength.
申请公布号 JPH1062995(A) 申请公布日期 1998.03.06
申请号 JP19960215731 申请日期 1996.08.15
申请人 FUJI PHOTO FILM CO LTD 发明人 SATO KENICHIRO;KODAMA KUNIHIKO;UENISHI KAZUYA;AOSO TOSHIAKI
分类号 G03F7/004;G03F7/039;G03F7/30;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/004
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