| 摘要 |
PROBLEM TO BE SOLVED: To test the conductive circuit of a substrate during transfer by using a solder storage mount provided with structurized conductive coating having a bonding pad and transferring a solder sump to the bonding pad of the substrate of the substrate to arrange the same. SOLUTION: In a solder storage mount 10, a conductive circuit structure 12 of structurized metal coating is formed on a support layer 11 and a transfer mask 14 is formed thereon by using a photosensitive polmer layer 12 having an opening part 15. The bonding pads 17 provided at the end parts of the individual circuits of the conductive circuit structure 12 are provided under the opening part 15 and the contact with the outside thereof is enabled on the surface of the transfer mask 14 and a solder sump 19 is formed on the opening part 15 by electrodeposition. The solder storage mount 10 is covered with a substrate 21 having a bump 22 formed thereon and the solder sump 19 is brought into contact with the bump 22 to be melted to wet the bump 22 and, thereafter, the substrate 21 is detached from the solder storage mount 10 along with the solder sump 19. During the contact of the substrate 21 with the solder storage mount 10, the electrical test of the substrate 21 becomes possible. |
