发明名称 METHOD AND APPARATUS FOR DECOMPOSING POLYMERIC MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To regenerate raw rubber from rubber pieces by selecting a laser beam of a wavelength which resonates to a stretching vibration of a specific molecular bond of a polymeric material from variable-wavelength mid infrared region laser beams and emitting it on the polymeric material, and selectively decomposing the specific molecular bonds of the polymeric material and decomposing the polymeric material. SOLUTION: A specific semiconductor device which produces a laser beam, having a wavelength resonating to the stretching vibration of the specific molecular bond of a rubber piece 5 to be composed is selected out of each semiconductor devices 2a, 2b,.... In the case of a benzyldisulfide having S-S bonds for example, the wavelength of the stretching vibration of its specific molecular bond is 13.2μm, and a rubber piece 5 of a polymeric material having an S-S bonds is decomposed by emitting a laser beam matching the vibration wavelength for selectively decomposing the specific molecular bonds by resonance. In this case, it is possible to regenerate the decomposed rubber piece 5 into original raw rubber, since decomposition is performed by selecting a wavelength which resonates to the stretching vibration of the S-S bonds of the sulfur S of the polymeric material of the benzyldisulfide.</p>
申请公布号 JPH1065284(A) 申请公布日期 1998.03.06
申请号 JP19960219792 申请日期 1996.08.21
申请人 JIYUU DENSHI LASER KENKYUSHO:KK 发明人 TOMIMASU TAKIO;OGINO SEIJI
分类号 B09B3/00;C08J7/00;C08J11/00;C08J11/10;H01S3/30;(IPC1-7):H01S3/30 主分类号 B09B3/00
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