| 摘要 |
PROBLEM TO BE SOLVED: To prevent compression deformation of polyimide on the lid junction surface due to pressure at the time of mounting on a board, together with preventing a break of a conductor wiring layer of the inside in an LGA type wiring substrate, being so constituted that the substrate surface has a plurality of wiring layer parts, wherein a plurality of conductive wiring layers are formed through a polyimide resin layer on the substrate surface, and a lid is to be joined with the plurality of wiring layer parts. SOLUTION: A number of metal columns 8, 8 of copper are set up on a plurality of wiring layer parts of a region to be connected by a lid. Copper has a far larger Young's modulus than polyimide, so that pressure at the time of mounting is almost exerted on a metal column (group) 8 so as to prevent compression deformation of a plurality of wiring layer parts. Especially, when a metal body is formed of the same material and configuration as that of conductive via-holes in the vertical direction passing through a plurality of conductive wiring layers and insulative resin layers, the metal columns can be simultaneously formed during the processes of its conductive wiring layers and the via-holes, thus allowing effective manufacture without any additional process and unnecessary cost.
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