| 摘要 |
PROBLEM TO BE SOLVED: To enhance heat dissipation and absorption performance of a heat plate by arranging P-type and N-type thermoelectric elements alternately and sandwiching the elements by dielectric heat plates, provided with a plurality of protrusions and recesses on the surface. SOLUTION: Each heat plate 1, 2 made of alumina ceramics, for example, has inner surface (rear surface) on which specified electrodes 3, 4 are formed by Cu plating, for example, and outer surface (surface) on which a plurality of protrusions and recesses 5, 6 are formed. The protrusions and recesses 5, 6 are formed in a pyramid shape, for example, and a metal plating layer, e.g. Cu-plating layers 7, 8, are formed on the surface thereof and solder coating layers 9, 10 are formed thereon for the purpose of coupling with other components. The protrusions and recesses 5, 6 can be formed by making V- grooves from the X and Y axial directions, using a dicing saw, and the Cu- plating layer can be formed by applying a Cu-plating layer of several tens ofμm thickness to an electroless Ni-plating layer of severalμm thickness.
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