发明名称 SPRAY-COOLING AN ELECTRONIC COMPONENT
摘要 <p>The apparatus includes a housing (40) having a cavity (26), the cavity sized to enclose an electronic component (10). The housing includes a first layer (72) having a first aperture and a second layer (74) having a second aperture. The second aperture is in communication with the first aperture and in communication with the cavity. The first and second apertures are sized to receive a fluid, atomize the fluid and discharge the atomized fluid (70) into the cavity.</p>
申请公布号 WO1998009129(A1) 申请公布日期 1998.03.05
申请号 US1997011806 申请日期 1997.07.08
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