Carrier substrate for semiconductor chip of e.g. chip card

摘要

The carrier substrate has a metallic foil laminated with a non-conductive foil (1) and structured to provide contact surfaces (3) extending along two opposing edges of the carrier substrate, contacted by the chip mounted on the opposite side of the carrier substrate via openings in the latter. The contact surfaces are formed integral with respective conductor paths (4) lying in the same plane as the contact surfaces. The semiconductor chip can be received in a recess formed in the non-conductive foil.