PROCESS FOR SELECTIVE APPLICATION OF SOLDER

摘要

This invention concerns a process for selectively constructing bumps (10) on connection areas (11) of a substrate (12) in which the surface of the substrate is covered by a mask (14) in such a way that mask openings (13) forming deposit spaces (15) are placed above the connection areas and said deposit spaces are filled with a soldering material (17). Then, the soldering material is melted to form the bumps in the deposit spaces which, at least in areas in contact with the soldering material, cannot be wetted.