PROCESS FOR OPTIMIZING THE ADHESION BETWEEN MOLDABLE MATERIAL AND A PASSIVATION LAYER

摘要

This invention concerns a process for optimizing the adhesion in a plastic chip housing between the moldable material and the second organic passivation layer of polyimide. To that effect, a plasma-etching process with oxygen is additionally applied. In this way, the surface of the polyimide is essentially roughened. Use of a photosensitive polyimide is particularly advantageous because this eliminates the need to use an additional mask.