发明名称 |
SPRAY-COOLING AN ELECTRONIC COMPONENT |
摘要 |
The apparatus includes a housing (40) having a cavity (26), the cavity sized to enclose an electronic component (10). The housing includes a first layer (72) having a first aperture and a second layer (74) having a second aperture. The second aperture is in communication with the first aperture and in communication with the cavity. The first and second apertures are sized to receive a fluid, atomize the fluid and discharge the atomized fluid (70) into the cavity. |
申请公布号 |
WO9809129(A1) |
申请公布日期 |
1998.03.05 |
申请号 |
WO1997US11806 |
申请日期 |
1997.07.08 |
申请人 |
MOTOROLA INC. |
发明人 |
KOBRINETZ, ANTHONY;BULLOCK, MICHAEL, K. |
分类号 |
H05K7/20;F28F7/00;F28F13/02;H01L23/473;(IPC1-7):F28F7/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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