发明名称 SPRAY-COOLING AN ELECTRONIC COMPONENT
摘要 The apparatus includes a housing (40) having a cavity (26), the cavity sized to enclose an electronic component (10). The housing includes a first layer (72) having a first aperture and a second layer (74) having a second aperture. The second aperture is in communication with the first aperture and in communication with the cavity. The first and second apertures are sized to receive a fluid, atomize the fluid and discharge the atomized fluid (70) into the cavity.
申请公布号 WO9809129(A1) 申请公布日期 1998.03.05
申请号 WO1997US11806 申请日期 1997.07.08
申请人 MOTOROLA INC. 发明人 KOBRINETZ, ANTHONY;BULLOCK, MICHAEL, K.
分类号 H05K7/20;F28F7/00;F28F13/02;H01L23/473;(IPC1-7):F28F7/00;H01L23/34 主分类号 H05K7/20
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