| 摘要 |
PURPOSE:To prevent a coated wire from being electrified at the time of a wire bonding and to prevent each mechanism of a device, which is made contact with the wire, from being electrified by a method wherein an application of ultrasonic vibrations is intermittingly performed to a bonding tool between the time ranging from a time when the metal wire at one end of the wire is exposed and is bonded to an electrode on one side to a time when the other end of the wire is bonded to the other electrode. CONSTITUTION:A coated wire 5 is made a conductive connection with a first bonding side, that is, the side of the connection of an external terminal 2C of a semiconductor chip 2 with one end of the wire 5 by a ball bonding due to the formation of a metal ball 5A1, while a second bonding side, that is, the side of the connection of an inner lead 3B of a lead 3 with the other end of the wire 5 is made a conductive connection with the wire 5 by a thermocompression bonding and ultrasonic vibrations as a bonding part 5A2 without removing previously a coated film 5B. When the wire 5 passes through a bonding tool, the outer periphery part of the wire 5 is brought into contact with the surface of a conductive substance 16C, whereby static electricity being electrified in the film 5B of the wire 5 is removed. |
