Method of manufacturing organic substrate used for printed circuits

摘要

A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with free tackness films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the free tackness films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the free tackness films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste (4) are connected for electrical connection between the metal foils (5).