发明名称 Sputter-resistant conductive coatings with enhanced emission of electrons for cathode electrodes in DC plasma addressing structure
摘要 <p>A conductive refractory compound coating for electrodes is sputter resistant, very resistant to oxidation, and easy to apply by way of electrophoresis or screen printing. This structure is further enhanced by the presence of surface particles of electrically nonconductive ceramic material. when the cathode electrode is energized, electrically nonconductive material is penetrated by the electric field, which attracts secondary electrons out of the cathode electrode, thereby increasing the cathode's efficiency as an emitter of secondary electrons. More specifically, cathode electrodes are used in a plasma addressing structure. The coating is formed by approximately 5 nm particles, each comprised of a fused matrix of conductive and nonconductive particles co-deposited with frit particles by either electrophoresis or "silk" screening. The coating is subsequently baked to fuse the frit and bond the electrophoretically deposited particles to the electrodes. &lt;IMAGE&gt;</p>
申请公布号 EP0827176(A2) 申请公布日期 1998.03.04
申请号 EP19970306147 申请日期 1997.08.13
申请人 TEKTRONIX, INC. 发明人 MOORE, JOHN S.;STEIN, WILLIAM W.;KEPHART, DONALD E.
分类号 G02F1/1333;G09F9/35;H01J9/02;H01J11/00;H01J17/06;(IPC1-7):H01J9/02;H01J17/04;H01J17/48 主分类号 G02F1/1333
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