发明名称 Bonding pad
摘要 A bonding pad for an orthodontic attachment to be bonded to a tooth, including a foil or plate having a photoetched surface, and a layer of mesh material diffusion bonded to the photoetched surface of the foil, thereby greatly increasing the bonding strength of the attachment to which the bonding pad is secured.
申请公布号 US5722826(A) 申请公布日期 1998.03.03
申请号 US19970803015 申请日期 1997.02.21
申请人 AMERICAN ORTHODONTICS CORPORATION 发明人 TUNEBERG, LEE H.;GAGIN, WILLIAM P.
分类号 A61C7/16;(IPC1-7):A61C7/00 主分类号 A61C7/16
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