发明名称 |
Bonding pad |
摘要 |
A bonding pad for an orthodontic attachment to be bonded to a tooth, including a foil or plate having a photoetched surface, and a layer of mesh material diffusion bonded to the photoetched surface of the foil, thereby greatly increasing the bonding strength of the attachment to which the bonding pad is secured.
|
申请公布号 |
US5722826(A) |
申请公布日期 |
1998.03.03 |
申请号 |
US19970803015 |
申请日期 |
1997.02.21 |
申请人 |
AMERICAN ORTHODONTICS CORPORATION |
发明人 |
TUNEBERG, LEE H.;GAGIN, WILLIAM P. |
分类号 |
A61C7/16;(IPC1-7):A61C7/00 |
主分类号 |
A61C7/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|