ADHESIVE FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

An adhesive film is provided to control specific yield strength and tensile slope of elastic region by controlling composition and content and to lower burr generation in a dicing process of a dicing die-bonding film. An adhesive film comprises a base material film and an adhesive layer. The adhesive layer has yield strength 20-50 gf of at thickness of 5-50 micron, and a tensile slope of an elastic region of 30-80 gf/mm. The adhesive layer comprises a thermoplastic resin and a thermosetting resin. The thermosetting resin comprises a hardener. The dicing die-bonding film comprises a dicing film and the adhesive film formed on one surface of the dicing film.