Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same

摘要

A conductive paste for filling through holes for the interlayer electrical connection in a low-temperature firable ceramic circuit substrate to be fired at 800 DEG to 1,000 DEG C., which comprises a) 100 parts by weight of flaky and/or spherical silver-based powder particles; b) 0.1 to 2.0 parts by weight of b1) Sb2O3 or a substance which is converted into Sb2O3 by the firing and the amount of which is given in terms of Sb2O3 and/or b2) Rh powder; and c) at least 3 parts by weight of 2-tetradecanol. The conductive paste has excellent printing properties and homogeneity because the viscosity change thereof is only small when it is printed into through holes of a ceramic circuit substrate and the crack formation after the firing is slight. Thus, the conductive paste is effective for efficient production of a ceramic circuit substrate of a high density wiring. The conductive paste may contain at least one organic resin selected from the group consisting of ethylcellulose, hydroxyethylcellulose and an acrylic resin.