发明名称 SUBSTRATE CLAMPING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To contrive a high speed revolution by constituting a device to surely clamp the substrate in its peripheral edge part via energizing force of an energizing means by being held by a plurality of fixed pawls and rotary pawls and to simultaneously raise a full open pin by raising an open member. SOLUTION: To clamp a substrate S, operating fluid is introduced into the upper side cylinder chamber 35 of a piston part 36, a ring-shaped member 34 is also raised integrally with a cylindrical member 33, a full open pin 23 is simultaneously lifted upward and a rotary pawl 16 is opened against a coil spring 20. The substrate S is dropped in a fixed pawl 14, the peripheral edge part of the substrate S is mounted and held on the upper surface of the substrate mounting part 15 of the fixed pawl 14, operating fluid is introduced into the lower side cylinder chamber 35 of the piston part 36, the ring-shaped member 34 is also lowered integrally with the cylindrical member 33, the full open pin 23 is lowered by gravity and reaction force of the coil spring 20 and the rotary pawl 16 is closed by the coil spring 20. A substrate stage 12 and the substrate S clamped are revolved at high speed via a rotary shaft 10 and a spin drying is performed for the substrate S.</p>
申请公布号 JPH1059540(A) 申请公布日期 1998.03.03
申请号 JP19970137834 申请日期 1997.05.12
申请人 EBARA CORP 发明人 MAEKAWA TOSHIRO;HARAGUCHI TATSUHITO
分类号 B65G49/07;B25J15/08;H01L21/304;H01L21/677;H01L21/68;(IPC1-7):B65G49/07 主分类号 B65G49/07
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