| 摘要 |
A method of making a data access arrangement (DAA) device. The method includes providing a substrate with a DAA circuit, containing optically active electrical components, mounted on it and individually encapsulating each optically active component with an optical medium. An opaque material is transfer molded about the substrate to completely encase the substrate and all of the circuit components. Before the transfer molding, a lead frame is attached to the substrate that extends through and beyond the opaque material to enable electrical contact with the substrate and the circuit components.
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