| 摘要 |
PROBLEM TO BE SOLVED: To provide a sintered compact which has high reliability and is easily and safely produced and a process for producing the same. SOLUTION: A heat sink 1 has a heat sink body 2 consisting of the sintered compact. This heat sink body 2 comprises a substrate 3, plural projections 4 formed integrally with this substrate 3 on the heat radiation surface side of the substrate 3 and a mold frame 5 formed integrally with the substrate 3 so as to enclose the respective projections 4. Circular mold holes 6 are formed at the four corners of the substrate 3. A joint surface to be joined to a semiconductor chip which is a heating element is formed on the side of the substrate 3 opposite to its heat radiation surface. For example, a plating layer is formed on this joint surface. The heat sink body 2 comprises the sintered compact of metallic powder and the metallic compsn. thereof contains 2 to 50wt.% Ag in at least one kind of W and Mo. Further, the compsn. contains <=10wt.% transition metal. |
