发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device capable of shortening a work time and reducing the consumption of a grinding fluid. SOLUTION: This polishing method feeds a grinding fluid to the surface of an abrasive cloth 1 stuck to the surface of a level block 2, and polishes the surface of a substrate 5 as a workpiece pressed to the prescribed part of the abrasive cloth 1 rotating together with the block 2, along a rotating radial direction. In this case, the droplets of the grinding fluid are supplied to a plurality of the prescribed parts (a), (b) and (c) of the abrasive cloth 1 separated from each other in the rotating radial direction and kept different from the pressed part of a substrate 5 as a workpiece. Alternatively, the grinding fluid is supplied to a single or a plurality of the prescribed parts of the abrasive cloth 1, different from the pressed part of the substrate 5, along a rotating radial direction under direct contact therewith.
申请公布号 JPH1058312(A) 申请公布日期 1998.03.03
申请号 JP19960221337 申请日期 1996.08.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SATAKE MITSUNARI;NISHIO MIKIO;MURAKAMI TOMOYASU
分类号 B24B37/00;H01L21/304 主分类号 B24B37/00
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