| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for molding capable of imparting an excellent mechanical strength, toughness, heat resistance and thermal conductivity and useful for a molded product, etc., for a high voltage equipment such as a coil equipment by blending a specific epoxy resin with a specified polymer particle and an inorganic filler. SOLUTION: This resin composition for molding comprises (A) an epoxy resin of formula I [R1 is H or a 1-4C alkyl; (x) is 1-4; (n) is 0-20], II, etc., having <=10,000 molecular weight, (B) an acid anhydride, (C) a curing accelerator, (D) a coupling agent, (E) fine polymer particles having 0.01-5μm average particle diameter and (F) an inorganic filler (e.g. the one having <=40μm average particle diameter and containing >=5wt.% particles having <=5μm particle diameter such as a silica filler or an alumina filler) containing <=15wt.% filaments (e.g. glass filament) having 20-500μm average length based on the total composition, and includes 60-90wt.% component F based on the total composition.
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