Packaging method of BGA type electronic component

摘要

A packaging method of an electronic component for packaging the electronic component to a packaging substrate comprises the steps of: forming a predetermined quantity of solder bumps at connection portions of the electronic component; forming through-holes and pads on the packaging substrate in such a manner as to correspond to the solder bumps; applying a solder paste to pad portions of the through-holes and the pads formed on the surface of the packaging substrate in such a manner as to attain a specific quantity of solder components with the predetermined quantity of the solder bump; and heating the electronic component and the packaging substrate to a predetermined temperature such that button-shaped connection bumps having a predetermined height are formed between the pads and the packaging substrate so as to connect the electronic component and the packaging substrate and to keep a predetermined gap between the electronic component and the packaging substrate, and cylindrical-post connection bumps are formed between the through-holes and the packaging substrate in accordance with this predetermined gap so as to connect the electronic component and the packaging substrate. In this way, the cylindrical-post connection bumps are formed in association with the button-shaped connection bumps.