| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive tape for holding electronic components in parallel with each other which has good adhesiveness, prevents the pomponents from sliding and has excellent impact resistance by incorporating a thermoplastic resin and a rosin-based resin as components of the adhesive layer of a specified adhesive tape. SOLUTION: An adhesive is obtained by mixing 100 pts.wt, thermoplastic resin which is any of polyethylenes, ethylene/vinyl ester copolymers, ethylenicallyα,β-nsaturated carboxylic acid copolymers or combinations thereof, has no pressure-sensitive adhesiveness at ordinary temperature and has a storage modulus (E') of 5×10<6> Pa or above at 20 deg.C in the measurement of dynamic viscoelasticity with 20-150 pts.wt. rosin having an acid value of 2 or above and a softening point of 60-180 deg.C, e.g. diroportionated rosin, an optonally a filler such as glass fibers, a lubricant, etc. This is applied to a support base being a plastic film or a paper material subjected to corona discharge treatment or coated with an anchor agent to obtain an adhesive tape for holding lead- mounted electronic components arranged to form a blind-like assemblage.
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